NVIDIA Jetson AGX Xavier Developer Kit
The AGX Xavier Developer Kit (2018, $1,299 at launch) puts the 32 GB AGX Xavier module into a 105 × 105 mm kit with a heatsink and fan. It was much smaller than the mini-ITX TX1 and TX2 kits. The AGX Orin Developer Kit replaced it.
Hardware
Specs
| SoC | Jetson AGX Xavier |
|---|---|
| Process | 12 nm |
| CPU | 8× NVIDIA Carmel @ 2.26 GHz Armv8.2 |
| Memory | LPDDR4X 256-bit Up to 64 GB 136.5 GB/s |
| GPU | Volta, 512 CUDA cores, 64 Tensor Cores Vendor: OpenGL ES 3.2, Vulkan 1.2 |
| NPU | 2× NVDLA, 32 TOPS (INT8) Total of GPU and DLA |
| Storage | 32 GB eMMC 5.1 |
| TDP | 10–30 W |
| SoC page | NVIDIA Jetson Xavier (T194) |
Interfaces
| Board | NVIDIA Jetson AGX Xavier Developer Kit |
|---|---|
| Memory | LPDDR4X 256-bit 32 GB |
| Camera | 16-lane MIPI CSI-2 connector (up to 6 sensors, 36 virtual channels) |
| Display | 1× HDMI 2.0, DisplayPort via USB-C |
| Storage | 32 GB eMMC 5.1 (on module), microSD / UFS card socket, M.2 M-Key NVMe |
| PCIe | 1× PCIe x16 (x8 electrical): PCIe Gen 4 x8 1× M.2 M-Key: PCIe x4 (NVMe SSD) 1× M.2 E-Key: PCIe x1 (Wi-Fi / LTE / 5G, plus USB 2.0, UART, I2S) |
| SATA | 1× SATA eSATAp (via PCIe Gen 2 x1 bridge, combined with USB 3.0) |
| USB | 2× USB 3.1 Type-C (DisplayPort and Power Delivery) 1× USB 3.0 eSATAp combo |
| Ethernet | 1× 1 GbE |
| GPIO | 40-pin header (UART, SPI, CAN, I2C, I2S, DMIC, GPIO) |
| Audio | HD Audio header |
| Cooling | Fan and heatsink fitted |
| Dimensions | 105 × 105 mm |
Compare NVIDIA Jetson AGX Xavier Developer Kit with other boards and SoCs →